Quality Assurance Home / Quality / Quality Assurance  
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  Quality Assurance

Quality Policy

Technology Innovation, Superior Quality, Customer Comes First, Perfect Service

Quality Objective

Zero Defect Operation

10PPM Quality Level

100% on Time Delivery

 

 

 

 

 

 

 
  Quality System
Quality Assurance Department
 
Quality System IQC IPQC OQC/OQA Application/
Reliability Eng.
Documentation Control
Maintain ISO & QS
Management Review Meeting
Internal & External Audit
Process & Product Monitor
CAR Issue, Review & Follow up
Equipment Calibration
Quality Training
Incoming Inspection
Vendor Qualification
Vendor Rating
Vendor On-Site Audit
First Article Inspection
Initiating CAR
Approved Vendor List
Non-conforming Material Control
MRB Meeting/Review
Roving Inspection
GPRC Functional Testing
Furnace Temp. Profile measurement
TMTT Setting Monitor
Machine Maintenance Monitor
SPC & CPK
CAR Issue, Review and Follow up
FA & Corrective Action
Lot by Lot Electrical Inspection
Lot by Lot Mechanical Inspection
ODMR Issue, Review & Follow up
Surveillance Control Inspection
Self Life Control
FA & Corrective Action
Product & Yield Quality Improvement
Out of Box Audit
On-Going reliability Test
Qualification Test
RMA/FA
Product Test Specification Issue
Product Quality & Reliability Improvement
FIT/MTTF Report
Customer Application Support
Data Sheet Publication
Note: CAR: Corrective Action Request/Report QRB: Quality Review Board FA: Failure Analysis
MTTF: Mean Time To Failure RMA: Return Material Authorization FIT: Failure In Time
MRB: Material Review Board ODMR: Outgoing Discrepant Material Report
 
  Reliability Testing Flow
 
Production Process
Production Process
Long - Term Life Test   Short - Term Life Test
OK Test Result
Judgment
NG
  Continue Shipment
& Production
  Abnormal Notice
& Failure Analysis
Verification
& Standardization
  1. Stop Shipment
2. Notify Customer
to Call back
3. Take corrective
actions
     
 
  Reliability Testing
 
  Test Item Test Condition Quality Level Criteria
1. SOLDER RESISTANCE TEMPERATURE OF SOLDER POT=260℃+5℃/-0℃ DURATION TIME FOR DIPPING IN SOLDER = 10+/-1SEC S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY
2. Solderability TEMPERATURE OF SOLDER POT = 230℃+/-5℃ S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY
3. HTIR Ta = 100℃/ 125℃150℃/175℃ S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY
4. HTRB Ta = 150℃+ /-5℃ ( SRⅡ) VR = 80% RATED TESTING TIME:1000HRS S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY
5. PCT Ta=121℃ P = 15PSI TESTING TIME:96HRS S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY
6. OP Life Ta=25℃ Power 60Hz, I = Rated Io TESTING TIME:1000HRS S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY
7. Forward Surge SINE WAVE 60Hz IFSM PER CUSTOMER SPEC TESTING TIME:8.3 ms, T=1 CYCLE S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY
8. Thermal Fatigue ON =5 MIN. FOR RATED Io OFF=5 MIN. FOR Ta TESTING TIME:300CYCLES S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY
9. Temperature Cycling Ta=-65℃ to + 175℃ DWELLED FOR 30 MIN. AND TRANSFERED FOR 5 MIN. NUMBER OF CYCLES:10CYCLES S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY
10. Steam Aging Ta=98~100℃ TESTING TIME:8HRS S.S. = 22 LTPD 10 ACCEPT FOR 0 FAILURE ONLY

   
   
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