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    ZOWIE's brand new compact, high thermal performance Zpak series is now available. 
      2011-05-19
     
   

 ZOWIE's brand new compact, high thermal performance ZPAK series is now available

ZOWIE developed the ZPAKTM high current density surface mount family  with wide heatsink design for superior thermal performance and  reliability.ZOWIE developed the ZPAK  high current surface mount family with wide heatsink design for superior thermal performane and reliability. 

The ZPAK  family was ideal for high temperature operations and designed to provide more power capability in a small space for applications such as the compact SMPS, lighting, solar junction box, DC fan and versatile portable electronics.

features

     Low profile SMD package                                                                                      

      Superior thermal performance and reliability

      High current density and surge

      Environmental friendly

ZPAK Family (SCD with high thermal performance)

 ZOWIE developed the ZPAKTM high current density surface mount family  with wide heatsink design for superior thermal performance and  reliability.

Low Profile and Compact

       Z1PAK / Z2PAK -Only 0.9 /1mm tall, compare

           (w/ 0.9mm/1.2mm for SOD-323/SOD-123)   

       Z3PAK -Only 1.2mm tall, occupies only 21mm  of PCB space, ideal for

           height limited applications, good replacement for DPAK, TO packages 

         Z4PAK -Only 1.3mm tall, occupies only 31mm  of PCB space, ideal for 

           height limited applications, good replacement for GBP & DFS packages 

 

 Please visit the High Thermal Performance Schottky Rectifiers - ZPAK™ series

                                High Thermal Performance Bridge Rectifiers - ZPAK™ series

 



     
   
   
     
   
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